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Toshiba Names Shardul Kazi to Head Up Newly Merged ASSP Business Unit, Promotes Andrew Burt to Vice President of New Imaging and Communications Market

6 April 2006

Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has merged its ASSP Business Unit and Embedded Processor SoC Business Unit into a new ASSP Business Unit. Shardul Kazi, a veteran Toshiba executive who was formerly vice president of the Embedded Processor SoC Business Unit, becomes vice president of the merged ASSP Business Unit. Reporting to System LSI Group Senior Vice President Hideya Yamaguchi, Mr. Kazi will oversee two new marketing groups, the Digital Multimedia Marketing Group and the Imaging and Communications Marketing Group; he will also direct all ASSP engineering and Software engineering activities. In a related move, Andrew Burt, previously a director in the ASSP Business Unit, was promoted to vice president of the Imaging and Communications Marketing Group.


"This new organizational structure will allow us to better serve our customers through closer product synergy and synchronized ASSP engineering activities," said Shardul Kazi, vice president of the ASSP Business Unit. "Andrew Burt's promotion to vice president is a well-earned recognition of his commitment and dedication to TAEC and our customers. I am pleased that he will be leading the new Imaging and Communications Marketing Group and look forward to his continued contributions."


The Imaging and Communications Marketing Group will be responsible for all marketing activities for the CMOS image sensor, CCD, wireless IC, RFIC, MPEG-4, automotive, analog and peripheral, and microcontroller product lines. The Digital Multimedia Marketing Group will be under the management of Tetsuro Wada, director of business development and technical marketing, a lateral change. The Digital Multimedia Marketing Group will be responsible for all marketing activities for the TX RISC, digital TV, analog TV and audio product lines.


*About TAEC


Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes memory and flash memory-based storage solutions, a broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless components for the computing, wireless, networking, automotive and digital consumer markets.


TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan's second largest semiconductor manufacturer and the world's ninth largest integrated manufacturer of electric and electronic equipment. In almost 130 years of operation, Toshiba has recorded numerous firsts and made many valuable contributions to technology and society. For additional company and product information, please visit TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.


Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.chips.toshiba.com, or from your TAEC representative.


All trademarks and tradenames used herein are the properties of their respective holders.

Source: prnewswire


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